IC Packaging Substrate
Main IC Packaging Substrate Types & Characteristics
| Type | Base Material | Application Scenarios | Key Recyclables |
| FC-BGA | ABF film (Ajinomoto Build-up Film) | High-performance CPUs/GPUs | High gold yield (gold wires + gold plating) |
| FCCSP | BT resin/ABF | Mobile chips, memory devices | Gold wire bonding + solder ball alloys |
| PBGA | BT resin | Mid-low end processors, comms chips | Gold-plated pins + copper substrate |
| Ceramic Substrate | Al₂O₃/AlN (Alumina/Aluminum Nitride) | Military, power modules | Palladium-silver conductors + high-purity aluminum |
| Metal Substrate | Copper/aluminum + insulation | LEDs, power modules | Copper layer (>90% purity) |
Details
REVERENCE INTERNATIONAL SP. Z O. O. recycles all types of IC packaging substrate, including ABF, BT, ceramic, and metal substrates. Major IC packaging substrate brands include Ibiden, Shinko, Unimicron, and SEMCO. We provide complete eco-friendly dismantling and resource recovery services for waste substrates from these brands.
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